Jobs

Volantis is seeking a hands-on Packaging Engineer specializing in Materials to lead wafer level mold and underfill process development for advanced semiconductor packages. This role involves owning material selection, qualification, and process optimization for molding and underfill, ensuring robust package performance from concept to high-volume production. The ideal candidate will have strong experience in wafer level molding and underfill processes, a deep understanding of material science, and the ability to collaborate with OSATs and material suppliers. This is a full-time, hybrid remote position with locations in the SF Bay Area, Austin, or Boston.