Jobs

Lyte AI is seeking an experienced Packaging and Assembly Lead to manage optical sensor device packaging and contract manufacturing processes. This role involves leading NPI process teams, optimizing wafer and PCBA assembly for yield improvement, and collaborating with RnD and external manufacturers. The ideal candidate will have a Master's or Ph.D. with 8+ years of experience in microelectronic and optical device packaging, process integration, and project management. This is an opportunity to build impactful technology in a dynamic, hands-on environment.