Jobs

Lumilens is seeking an experienced IC Package Mechanical FEA Engineer to drive the next generation of high-performance packaging solutions for advanced ASICs, redefining the optical layer for AI and high-performance computing. In this role, you will design, model, and optimize advanced multi-chip-module (MCM) architectures and mainstream flip-chip BGA (FCBGA) packages. You will perform FEA simulations to evaluate stress, warpage, and reliability risks, collaborating with R&D, manufacturing, and reliability teams. This position requires deep expertise in advanced packaging technologies and proficiency with FEA tools like Ansys and Abaqus, with a direct impact on the future of AI supercomputing infrastructure.