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Head of Device Fabrication, Advanced Packaging and Assembly
Head of Device Fabrication, Advanced Packaging and Assembly
Universal QuantumUniversal Quantum is seeking a Head of Device Fabrication, Advanced Packaging and Assembly to lead the development, industrialisation, and delivery of foundry processes and advanced packaging for quantum processors. Based in Singapore, this role involves leading a global team, managing strategic relationships with semiconductor partners, and owning the R&D roadmap from concept to manufacturing. The ideal candidate will possess deep technical leadership, experience in semiconductor process development, and a proven track record of taking technology from concept to production readiness. This is an opportunity to shape the future of quantum computing and contribute to a rapidly growing company.