Jobs

TYLsemi is seeking a Principal SI/PI, Package and Power Delivery Engineer to own signal integrity, power integrity, and package/PDN co-design for AI/HPC systems. This role involves driving SI/PI methodology, performing co-design across chip, package, and board, and ensuring robust high-speed links and stable power delivery from architecture through tapeout. The ideal candidate will have 10+ years of experience in SI/PI and package/PDN solutions for complex SoCs, strong fundamentals in electrical engineering, and a methodical approach to problem-solving. Join a fast-paced, global team building critical chiplet infrastructure IP for the exploding AI market.