Jobs

Volantis is seeking an Advanced Packaging Engineer to contribute to and own aspects of their A-0 and A-1 packages. This role involves tackling significant challenges in warpage, CTE mismatch, and thermomechanical aspects to build a wafer-scale package with silicon and compound semiconductor dies at very high TDP. The ultimate goal is to break the memory wall and enable a new era of AI. Candidates should possess strong first-principles thinking and experience in complex package design or process development.