Jobs

Eridu is seeking a highly experienced Advanced Packaging Engineer to lead system module packaging and advanced single chip Flip Chip IC integration for next-generation high-performance networking and compute platforms. This technical leadership role involves end-to-end productization of composite system modules, driving manufacturing readiness from architecture through volume production. The ideal candidate will have 8+ years of experience in system module assembly and advanced IC packaging, with hands-on expertise in organic substrates, SMT assembly, and Flip-chip packaging. This unique opportunity offers direct ownership of real system products, technical leadership across the entire packaging stack, and the chance to architect next-generation system module platforms for AI infrastructure.