Jobs

Universal Quantum is seeking a Semiconductor Package Development Engineer in Tokyo to develop advanced semiconductor packaging solutions for next-generation quantum microchips. This role involves initiating packaging concepts, driving IC package development using ceramic technology, and creating packages for testing in extreme environments like cryogenic and low vacuum. The ideal candidate will have a PhD or senior expertise in relevant engineering fields, strong communication skills in both Japanese and English, and experience in package design, micro-assembly, and thermo-mechanical simulations.