Jobs

TylSemi is seeking a highly experienced Principal Physical Design Engineer to lead complex ASIC/SOC physical implementation activities for chiplet infrastructure IP, crucial for the exploding AI/HPC market. This role involves end-to-end physical design from floorplanning to GDSII signoff, driving advanced node implementation methodologies, and ensuring high-quality tape-outs. The ideal candidate will possess deep expertise in physical design, proficiency with EDA tools like Cadence Innovus and Synopsys ICC2, and a proven track record of successful tape-outs at advanced technology nodes. You will collaborate with cross-functional teams, mentor junior engineers, and contribute to building the silicon infrastructure that powers AI.