Jobs

We are seeking an experienced Packaging Engineer- Flip Chip to lead the development and optimization of flip chip package development and assembly processes for advanced semiconductor devices. This role involves owning the entire process, from bump metallurgy and substrate integration to reflow, underfill, reliability, and failure analysis. The ideal candidate will have strong experience in flip chip packaging, bumping technologies, and underfill processes, with the ability to collaborate cross-functionally and debug yield and reliability issues. This is a full-time, hybrid remote position with locations in the SF Bay Area, Austin, or Boston.