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EriduAbout the role
Eridu is seeking an experienced Substrate Layout Design Engineer to develop advanced multi-die organic flip-chip modules for high-density, high-performance substrates. This role involves physical layout using Siemens Xpedition, ensuring routing feasibility, and aligning designs with mechanical and system constraints. The successful candidate will collaborate with various engineering teams to implement and ensure manufacturability for complex multi-chip packages, contributing to groundbreaking AI infrastructure solutions.
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